JPH0258209A - チップ形コンデンサ - Google Patents

チップ形コンデンサ

Info

Publication number
JPH0258209A
JPH0258209A JP63209060A JP20906088A JPH0258209A JP H0258209 A JPH0258209 A JP H0258209A JP 63209060 A JP63209060 A JP 63209060A JP 20906088 A JP20906088 A JP 20906088A JP H0258209 A JPH0258209 A JP H0258209A
Authority
JP
Japan
Prior art keywords
capacitor
groove
lead wire
leads
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63209060A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0447447B2 (en]
Inventor
Ikuo Hagiwara
郁夫 萩原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Chemi Con Corp
Original Assignee
Nippon Chemi Con Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Chemi Con Corp filed Critical Nippon Chemi Con Corp
Priority to JP63209060A priority Critical patent/JPH0258209A/ja
Publication of JPH0258209A publication Critical patent/JPH0258209A/ja
Publication of JPH0447447B2 publication Critical patent/JPH0447447B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP63209060A 1988-08-23 1988-08-23 チップ形コンデンサ Granted JPH0258209A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63209060A JPH0258209A (ja) 1988-08-23 1988-08-23 チップ形コンデンサ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63209060A JPH0258209A (ja) 1988-08-23 1988-08-23 チップ形コンデンサ

Publications (2)

Publication Number Publication Date
JPH0258209A true JPH0258209A (ja) 1990-02-27
JPH0447447B2 JPH0447447B2 (en]) 1992-08-04

Family

ID=16566591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63209060A Granted JPH0258209A (ja) 1988-08-23 1988-08-23 チップ形コンデンサ

Country Status (1)

Country Link
JP (1) JPH0258209A (en])

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0488616A (ja) * 1990-07-31 1992-03-23 Sanyo Electric Co Ltd 面実装電子部品
JPH04109612A (ja) * 1990-08-29 1992-04-10 Sanyo Electric Co Ltd 面実装電子部品
DE202011000854U1 (de) * 2011-04-12 2012-07-13 Frolyt Kondensatoren Und Bauelemente Gmbh Elektrolytkondensator

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6342512U (en]) * 1986-09-04 1988-03-22
JPS6342513U (en]) * 1986-09-08 1988-03-22

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6342512U (en]) * 1986-09-04 1988-03-22
JPS6342513U (en]) * 1986-09-08 1988-03-22

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0488616A (ja) * 1990-07-31 1992-03-23 Sanyo Electric Co Ltd 面実装電子部品
JPH04109612A (ja) * 1990-08-29 1992-04-10 Sanyo Electric Co Ltd 面実装電子部品
DE202011000854U1 (de) * 2011-04-12 2012-07-13 Frolyt Kondensatoren Und Bauelemente Gmbh Elektrolytkondensator

Also Published As

Publication number Publication date
JPH0447447B2 (en]) 1992-08-04

Similar Documents

Publication Publication Date Title
EP0320013B1 (en) Chip type capacitor and manufacturing thereof
JPS60220922A (ja) チツプ型コンデンサ
JPH0258209A (ja) チップ形コンデンサ
JP2627778B2 (ja) チップ形コンデンサ
JP2894332B2 (ja) チップ形コンデンサ
JP2832719B2 (ja) チップ形コンデンサ
JP2691420B2 (ja) チップ形コンデンサ
JP2838705B2 (ja) チップ形コンデンサ
JP2640497B2 (ja) チップ形コンデンサおよびその製造方法
JP2838711B2 (ja) チップ形コンデンサ
JP2691409B2 (ja) チップ形コンデンサ
JP2653025B2 (ja) チップ形コンデンサおよびその製造方法
JP2841339B2 (ja) チップ形コンデンサ
JPH0265207A (ja) チップ形コンデンサ
JP2720390B2 (ja) チップ形コンデンサ
JP2727950B2 (ja) チップ形電解コンデンサ
JP2691412B2 (ja) チップ形コンデンサ
JP2564155B2 (ja) チップ形コンデンサ
JPH1197276A (ja) チップ形コンデンサ
JPH01152611A (ja) チップ形コンデンサ
JPH0467332B2 (en])
JP2000100645A (ja) チップ形コンデンサ
JPH01152612A (ja) チップ形コンデンサ
JP2000269072A (ja) チップ形コンデンサ
JPH01173706A (ja) チップ形コンデンサ

Legal Events

Date Code Title Description
S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080804

Year of fee payment: 16

LAPS Cancellation because of no payment of annual fees